Products Description
1. Higher thermal conductivity
Compared with traditional PEEK materials, the thermal conductivity coefficient can be increased by two times. It has better heat dissipation and can fully meet the requirements of new products in the future 5G high transmission and high heat generation.
2. High mechanical strength
High mechanical strength, tensile strength up to 130MPa, compared with traditional PC mobile phone materials, the mechanical properties are improved by more than 6 times. Compared with glass ceramic materials, it has better drop resistance.
3. With metallic texture
It has a metallic feel and is a new material to replace metal mobile phone back covers in the future.
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